Thermodynamics Research Center / ThermoML | Thermochimica Acta

Enthalpies of mixing of liquid Bi Cu and Bi Cu Sn alloys relevant for lead-free soldering

Flandorfer, H.[Hans], Sabbar, A.[Abdelaziz], Luef, C.[Christoph], Rechchach, M.[Meryem], Ipser, H.[Herbert]
Thermochim. Acta 2008, 472, 1-2, 1-10
ABSTRACT
Partial and integral enthalpies of mixing of liquid ternary Bi Cu Sn alloys at 800 .C were determined along nine sections in a large composition range. Additionally, binary alloys of the constituent binary system Bi Cu were investigated at 800 and 1000 .C. Measurements were carried out using a Calvettype microcalorimeter and a drop calorimetric technique. The binary data were evaluated by means of a standard Redlich Kister polynomial fit whereas ternary data were fitted on the basis of an extended Redlich Kister Muggianu model for substitutional solutions.
Compounds
# Formula Name
1 Bi bismuth
2 Cu copper
3 Sn tin
Datasets
The table above is generated from the ThermoML associated json file (link above). POMD and RXND refer to PureOrMixture and Reaction Datasets. The compound numbers are included in properties, variables, and phases, if specificied; the numbers refer to the table of compounds on the left.
Type Compound-# Property Variable Constraint Phase Method #Points
  • POMD
  • 2
  • 1
  • Excess molar enthalpy (molar enthalpy of mixing), kJ/mol ; Liquid
  • Temperature, K; Liquid
  • Mole fraction - 2; Liquid
  • Pressure, kPa; Liquid
  • Liquid
  • Calvet calorimetry
  • 45
  • POMD
  • 3
  • 2
  • 1
  • Excess molar enthalpy (molar enthalpy of mixing), kJ/mol ; Liquid
  • Mole fraction - 1; Liquid
  • Mole fraction - 2; Liquid
  • Pressure, kPa; Liquid
  • Temperature, K; Liquid
  • Liquid
  • Calvet calorimetry
  • 267