ABSTRACT

Standard enthalpies of formation were determined for a number of binary intermetallic compounds in the systems Ag Sn, Cu Sn, and Ni Sn by means of solution calorimetry in liquid Sn in a Calvet-type microcalorimeter. For the pure elements Ag, Cu, and Ni, the limiting partial enthalpies of mixing as well as the enthalpies of solution at infinite dilution in Sn were measured at 773, 873, 973 and 1073 K. The results for the enthalpy of formation for the intermetallic compounds Ag3Sn, Ag4Sn, Cu3Sn, Cu41Sn11, Cu6Sn5, Ni3 Sn-LT, Ni3Sn2-HT, and Ni3Sn4 are discussed and compared with the corresponding literature values.

Compounds

#	Formula	Name
1	Cu	copper
2	Ni	nickel
3	Sn	tin
4	Ag	silver

Datasets

The table above is generated from the ThermoML associated json file (link above). POMD and RXND refer to PureOrMixture and Reaction Datasets. The compound numbers are included in properties, variables, and phases, if specificied; the numbers refer to the table of compounds on the left.
Type	Compound-#	Property	Variable	Constraint	Phase	Method	#Points
POMD	4 3	Molar enthalpy of solution, kJ/mol ; Liquid	Temperature, K; Liquid	Pressure, kPa; Liquid Mole fraction - 4; Liquid	Liquid	Calvet calorimetry	4
POMD	3 1	Molar enthalpy of solution, kJ/mol ; Liquid	Temperature, K; Liquid	Pressure, kPa; Liquid Mole fraction - 1; Liquid	Liquid	Calvet calorimetry	4
POMD	2 3	Molar enthalpy of solution, kJ/mol ; Liquid	Temperature, K; Liquid	Pressure, kPa; Liquid Mass fraction - 2; Liquid	Liquid	Calvet calorimetry	4

Thermodynamics Research Center / ThermoML | Thermochimica Acta

Interfaces in lead-free solder alloys: Enthalpy of formation of binary Ag Sn, Cu Sn and Ni Sn intermetallic compounds

Flandorfer, H., Saeed, U., Luef, C., Sabbar, A., Ipser, H.

ABSTRACT